Issued Patents 2016
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502383 | 3D integrated circuit package processing with panel type lid | Han-Ping Pu, Kim Hong Chen, Jung Wei Cheng, Chien Ling Hwang, Hsin-Yu Pan | 2016-11-22 |
| 9496189 | Stacked semiconductor devices and methods of forming same | Chen-Hua Yu, Chien-Hsun Lee, Jung Wei Cheng | 2016-11-15 |
| 9455236 | Integrated circuit packages and methods of forming same | Chen-Hua Yu, Chien-Hsun Lee, Jung Wei Cheng | 2016-09-27 |
| 9437551 | Concentric bump design for the alignment in die stacking | Jung Wei Cheng, Chien-Hsun Lee | 2016-09-06 |
| 9406632 | Semiconductor package including a substrate with a stepped sidewall structure | Jung Wei Cheng, Bo-I Lee | 2016-08-02 |
| 9362197 | Molded underfilling for package on package devices | Chen-Hua Yu, Chien-Hsun Lee, Jung Wei Cheng, Ming-Da Cheng, Yung Ching Chen | 2016-06-07 |
| 9355933 | Cooling channels in 3DIC stacks | Kai-Ming Ching, Ching-Wen Hsiao, Ming Hung Tseng, Chen-Shien Chen | 2016-05-31 |
| 9343433 | Packages with stacked dies and methods of forming the same | Chien-Hsun Lee, Mirng-Ji Lii, Chen-Hua Yu | 2016-05-17 |
| 9318465 | Methods for forming a semiconductor device package | Jung Wei Cheng, Chien-Hsun Lee, Chun-Chih Chuang | 2016-04-19 |
| 9275924 | Semiconductor package having a recess filled with a molding compound | Jung Wei Cheng, Bo-I Lee | 2016-03-01 |
| 9263377 | POP structures with dams encircling air gaps and methods for forming the same | Chen-Hua Yu, Chen-Shien Chen, Chung-Shi Liu, Jiun Yi Wu | 2016-02-16 |
| 9240387 | Wafer-level chip scale package with re-workable underfill | Hsien-Wei Chen, Chien-Hsiun Lee, Hao-Yi Tsai, Mirng-Ji Lii, Chen-Hua Yu | 2016-01-19 |