Issued Patents 2016
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502383 | 3D integrated circuit package processing with panel type lid | Tsung-Ding Wang, Han-Ping Pu, Kim Hong Chen, Chien Ling Hwang, Hsin-Yu Pan | 2016-11-22 |
| 9496189 | Stacked semiconductor devices and methods of forming same | Chen-Hua Yu, Chien-Hsun Lee, Tsung-Ding Wang | 2016-11-15 |
| 9455236 | Integrated circuit packages and methods of forming same | Chen-Hua Yu, Chien-Hsun Lee, Tsung-Ding Wang | 2016-09-27 |
| 9437551 | Concentric bump design for the alignment in die stacking | Tsung-Ding Wang, Chien-Hsun Lee | 2016-09-06 |
| 9406632 | Semiconductor package including a substrate with a stepped sidewall structure | Tsung-Ding Wang, Bo-I Lee | 2016-08-02 |
| 9362197 | Molded underfilling for package on package devices | Chen-Hua Yu, Chien-Hsun Lee, Tsung-Ding Wang, Ming-Da Cheng, Yung Ching Chen | 2016-06-07 |
| 9318465 | Methods for forming a semiconductor device package | Tsung-Ding Wang, Chien-Hsun Lee, Chun-Chih Chuang | 2016-04-19 |
| 9275924 | Semiconductor package having a recess filled with a molding compound | Tsung-Ding Wang, Bo-I Lee | 2016-03-01 |