Issued Patents 2016
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502383 | 3D integrated circuit package processing with panel type lid | Tsung-Ding Wang, Kim Hong Chen, Jung Wei Cheng, Chien Ling Hwang, Hsin-Yu Pan | 2016-11-22 |
| 9502360 | Stress compensation layer for 3D packaging | Chun-Hung Lin, Yu-Feng Chen, Hung-Jui Kuo | 2016-11-22 |
| 9472524 | Copper-containing layer on under-bump metallization layer | Yu-Feng Chen, Chun-Hung Lin, Chih-Hang Tung, Kai-Chiang Wu, Ming-Che Ho | 2016-10-18 |
| 9418956 | Zero stand-off bonding system and method | Chun-Hung Lin, Ming-Che Ho, Yu-Feng Chen, Yi-Wen Wu, Hsien-Liang Meng | 2016-08-16 |
| 9418947 | Mechanisms for forming connectors with a molding compound for package on package | Yu-Feng Chen, Chun-Hung Lin, Ming-Da Cheng, Kai-Chiang Wu | 2016-08-16 |
| 9406634 | Package structure and method of forming the same | Yuh Chern Shieh, Yu-Feng Chen, Tin-Hao Kuo | 2016-08-02 |
| 9355928 | Package-on-package structure | Yu-Feng Chen, Chun-Hung Lin, Chun-Cheng Lin, Ming-Da Cheng, Kai-Chiang Wu | 2016-05-31 |
| 9293404 | Pre-applying supporting materials between bonded package components | Yu-Chen Hsu, Yu-Feng Chen, Meng-Tse Chen, Guan-Yu Chen | 2016-03-22 |