Issued Patents 2016
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9493678 | Polishing composition | Yun-Lung Ho, Chun-Chieh Lee, Song-Yuan Chang, Ming-Hui Lu | 2016-11-15 |
| 9472524 | Copper-containing layer on under-bump metallization layer | Yu-Feng Chen, Chun-Hung Lin, Han-Ping Pu, Chih-Hang Tung, Kai-Chiang Wu | 2016-10-18 |
| 9430605 | Adjusting sizes of connectors of package components | Chih-Wei Lai, Tzong-Hann Yang, Chien Rhone Wang, Chia-Tung Chang, Hung-Jui Kuo +1 more | 2016-08-30 |
| 9418956 | Zero stand-off bonding system and method | Chun-Hung Lin, Yu-Feng Chen, Yi-Wen Wu, Hsien-Liang Meng, Han-Ping Pu | 2016-08-16 |
| 9397080 | Package on package devices and methods of packaging semiconductor dies | Chun-Lei Hsu, Yu-Feng Chen, De-Yuan Lu, Chung-Shi Liu | 2016-07-19 |
| 9373035 | Image capturing method for image recognition and system thereof | Ben Wu, Chih-Kao Chen | 2016-06-21 |
| 9368462 | Methods and apparatus of packaging semiconductor devices | Yi-Wen Wu, Wen-Hsiung Lu, Chia-Wei Tu, Chung-Shi Liu | 2016-06-14 |
| 9362236 | Package structures and methods for forming the same | Hsien-Liang Meng, Wei-Hung Lin, Jimmy Liang, Hung-Jui Kuo, Chung-Shi Liu +1 more | 2016-06-07 |
| 9263302 | Via structure for packaging and a method of forming | Yi-Wen Wu, Chien Ling Hwang, Hung-Jui Kuo, Chung-Shi Liu | 2016-02-16 |
| 9257401 | Method of fabricating bump structure and bump structure | Chun-Lei Hsu, Ming-Da Cheng, Chung-Shi Liu | 2016-02-09 |