Issued Patents 2016
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9524945 | Cu pillar bump with L-shaped non-metal sidewall protection structure | Chien Ling Hwang, Chung-Shi Liu | 2016-12-20 |
| 9418956 | Zero stand-off bonding system and method | Chun-Hung Lin, Ming-Che Ho, Yu-Feng Chen, Hsien-Liang Meng, Han-Ping Pu | 2016-08-16 |
| 9385076 | Semiconductor device with bump structure on an interconncet structure | Hsien-Wei Chen, Wen-Hsiung Lu | 2016-07-05 |
| 9368462 | Methods and apparatus of packaging semiconductor devices | Ming-Che Ho, Wen-Hsiung Lu, Chia-Wei Tu, Chung-Shi Liu | 2016-06-14 |
| 9305856 | Post-passivation interconnect structure AMD method of forming same | Hsien-Wei Chen | 2016-04-05 |
| 9287171 | Method of making a conductive pillar bump with non-metal sidewall protection structure | Cheng-Chung Lin, Chien Ling Hwang, Chung-Shi Liu | 2016-03-15 |
| 9263302 | Via structure for packaging and a method of forming | Ming-Che Ho, Chien Ling Hwang, Hung-Jui Kuo, Chung-Shi Liu | 2016-02-16 |