Issued Patents 2016
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502360 | Stress compensation layer for 3D packaging | Chun-Hung Lin, Yu-Feng Chen, Han-Ping Pu | 2016-11-22 |
| 9481746 | Modified high-cis isoprene polymer, method for producing the same, and tire containing aforementioned polymer | Chih-Cheng Lee | 2016-11-01 |
| 9478511 | Methods and apparatus of packaging semiconductor devices | Chun-Lin Lu, Hsien-Wei Chen, Kai-Chiang Wu | 2016-10-25 |
| 9430605 | Adjusting sizes of connectors of package components | Chih-Wei Lai, Ming-Che Ho, Tzong-Hann Yang, Chien Rhone Wang, Chia-Tung Chang +1 more | 2016-08-30 |
| 9431342 | Staggered via redistribution layer (RDL) for a package and a method for forming the same | Chen-Hua Yu, Chung-Shi Liu | 2016-08-30 |
| 9368402 | Conductive line system and process | Yu Yi Huang, Chung-Shi Liu | 2016-06-14 |
| 9362236 | Package structures and methods for forming the same | Hsien-Liang Meng, Wei-Hung Lin, Jimmy Liang, Ming-Che Ho, Chung-Shi Liu +1 more | 2016-06-07 |
| 9359462 | Modified high cis butadiene-isoprene copolymer, method for producing the same and tire having aforementioned polymer | Chih-Cheng Lee | 2016-06-07 |
| 9318429 | Integrated structure in wafer level package | Yu-Hsiang Hu, Chung-Shi Liu | 2016-04-19 |
| 9263302 | Via structure for packaging and a method of forming | Ming-Che Ho, Yi-Wen Wu, Chien Ling Hwang, Chung-Shi Liu | 2016-02-16 |