Issued Patents 2016
Showing 1–25 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9529666 | Decoding method, memory storage device and memory controlling circuit unit | Shao-Wei Yen, Yu-Hsiang Lin, Tien-Ching Wang, Kuo-Hsin Lai, Siu Tung Lam | 2016-12-27 |
| 9530762 | Semiconductor package, semiconductor device and method of forming the same | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Tsai-Tsung Tsai, Ming-Da Cheng | 2016-12-27 |
| 9530509 | Data programming method, memory storage device and memory control circuit unit | Tien-Ching Wang, Kuo-Hsin Lai, Yu-Cheng Hsu, Chi-Heng Yang | 2016-12-27 |
| 9526186 | Storage device and producing method of the same | Hung-I Chung | 2016-12-20 |
| 9518728 | Sphere structure | — | 2016-12-13 |
| 9514819 | Programming method, memory storage device and memory controlling circuit unit | Kiang-Giap Lau | 2016-12-06 |
| 9496041 | Memory programming method, memory control circuit unit and memory storage device | Yu-Cheng Hsu, An-Cheng Liu, Siu Tung Lam | 2016-11-15 |
| 9465584 | Method for generating random number, memory storage device and control circuit | Yu-Cheng Hsu, Siu Tung Lam | 2016-10-11 |
| 9460043 | Flash drive with transforming mechanism | Hung-I Chung, Chang-Chih Chen | 2016-10-04 |
| 9449934 | Solder joint structure for ball grid array in wafer level package | Yu-Hsiang Hu, Wei-Yu Chen, Ming-Da Cheng, Chung-Shi Liu | 2016-09-20 |
| 9437309 | Operating method of NAND flash memory unit | Yu-Cheng Hsu, Kuo-Yi Cheng | 2016-09-06 |
| 9431360 | Semiconductor structure and manufacturing method thereof | Hsuan-Ting Kuo, Yu-Peng Tsai, Chun-Lung Jao, Chao-Wen Shih, Ming-Da Cheng +1 more | 2016-08-30 |
| 9427818 | Semiconductor processing boat design with pressure sensor | Ai-Tee Ang, Hsiu-Jen Lin, Ming-Da Cheng, Chung-Shi Liu | 2016-08-30 |
| 9425569 | Storage device | — | 2016-08-23 |
| 9425157 | Substrate and package structure | Hsiu-Jen Lin, Ming-Da Cheng, Yu-Min Liang, Chen-Shien Chen, Chung-Shi Liu | 2016-08-23 |
| 9412689 | Semiconductor packaging structure and method | Chun-Cheng Lin, Chung-Shi Liu, Kuei-Wei Huang, Cheng-Ting Chen, Ming-Da Cheng | 2016-08-09 |
| 9412723 | Package on-package structures and methods for forming the same | Kuei-Wei Huang, Chih-Wei Lin, Hsiu-Jen Lin, Ming-Da Cheng, Chung-Shi Liu | 2016-08-09 |
| 9401337 | Molding structure for wafer level package | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Chih-Wei Lin, Ming-Da Cheng | 2016-07-26 |
| 9396804 | Memory programming method, memory control circuit unit and memory storage apparatus | — | 2016-07-19 |
| 9397062 | Package on package bonding structure and method for forming the same | Kuei-Wei Huang, Wei-Yu Chen, Meng-Tse Chen, Ming-Da Cheng, Chung-Shi Liu | 2016-07-19 |
| 9385040 | Method of manufacturing a semiconductor device | Tsai-Tsung Tsai, Wen-Hsiung Lu, Yu-Peng Tsai, Ming-Da Cheng, Chung-Shi Liu | 2016-07-05 |
| 9362236 | Package structures and methods for forming the same | Hsien-Liang Meng, Jimmy Liang, Ming-Che Ho, Hung-Jui Kuo, Chung-Shi Liu +1 more | 2016-06-07 |
| 9361024 | Memory cell programming method, memory control circuit unit and memory storage apparatus | Yu-Cheng Hsu | 2016-06-07 |
| 9349663 | Package-on-package structure having polymer-based material for warpage control | Meng-Tse Chen, Yu-Chih Liu, Hui-Min Huang, Jing Ruei Lu, Ming-Da Cheng +1 more | 2016-05-24 |
| 9349475 | Time estimating method, memory storage device, and memory controlling circuit unit | Yu-Cheng Hsu | 2016-05-24 |