Issued Patents 2016
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9524956 | Integrated fan-out structure and method | Hao-Jan Pei, Hsiu-Jen Lin, Ming-Da Cheng, Chung-Shi Liu, Chen-Hua Yu | 2016-12-20 |
| 9508703 | Stacked dies with wire bonds and method | Chen-Hua Yu, Ming-Fa Chen, Sung-Feng Yeh, Meng-Tse Chen, Hsiu-Jen Lin +2 more | 2016-11-29 |
| 9484285 | Interconnect structures for wafer level package and methods of forming same | Meng-Tse Chen, Chih-Wei Lin, Ming-Da Cheng, Chung-Shi Liu, Chen-Hua Yu | 2016-11-01 |
| 9449908 | Semiconductor package system and method | Chih-Wei Lin, Tsai-Tsung Tsai, Ming-Da Cheng, Chung-Shi Liu, Chen-Hua Yu | 2016-09-20 |
| 9390891 | Apparatus for charged particle lithography system | Shih-Chi Wang, Tsung-Chih Chien, Jaw-Jung Shin, Shy-Jay Lin, Burn Jeng Lin | 2016-07-12 |
| 9373508 | Semiconductor device and fabricating method thereof | Ta-Hsun Yeh, Yuh-Sheng Jean | 2016-06-21 |
| 9349663 | Package-on-package structure having polymer-based material for warpage control | Meng-Tse Chen, Yu-Chih Liu, Wei-Hung Lin, Jing Ruei Lu, Ming-Da Cheng +1 more | 2016-05-24 |
| 9299688 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Wei-Hung Lin, Ming-Da Cheng | 2016-03-29 |