Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502373 | Lid attach process and apparatus for fabrication of semiconductor packages | Chin-Liang Chen, Wei-Ting Lin, Kuan-Lin Ho, Jason Shen | 2016-11-22 |
| 9462507 | Load balancing method and system for multi-band network | Baiqiu Huang, Jun Feng, Chao Yao | 2016-10-04 |
| 9415501 | Apparatus for manufacturing a semiconductor device and method of manufacturing a semiconductor device | Kuan-Lin Ho, Chin-Liang Chen, Wei-Ting Lin, Shih-Yen Lin | 2016-08-16 |
| 9349663 | Package-on-package structure having polymer-based material for warpage control | Meng-Tse Chen, Hui-Min Huang, Wei-Hung Lin, Jing Ruei Lu, Ming-Da Cheng +1 more | 2016-05-24 |
| 9287233 | Adhesive pattern for advance package reliability improvement | Chin-Liang Chen, Wei-Ting Lin, Kuan-Lin Ho, Chun-Cheng Lin, Shih-Yen Lin | 2016-03-15 |