Issued Patents 2016
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9455725 | Phase detector and associated phase detecting method | Cheng-Liang Hung, Chih-Hsien Chang, Chao-Hsin Fan Jiang | 2016-09-27 |
| 9412717 | Apparatus and methods for molded underfills in flip chip packaging | Meng-Tse Chen, Hsiu-Jen Lin, Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu | 2016-08-09 |
| 9412689 | Semiconductor packaging structure and method | Chung-Shi Liu, Kuei-Wei Huang, Cheng-Ting Chen, Wei-Hung Lin, Ming-Da Cheng | 2016-08-09 |
| 9394918 | Fan structure with easy assembly | Li-Wei Liu | 2016-07-19 |
| 9379032 | Semiconductor packaging having warpage control and methods of forming same | Yu-Chih Huang, Kuei-Wei Huang, Yu-Feng Chen, Chen-Shien Chen | 2016-06-28 |
| 9355928 | Package-on-package structure | Yu-Feng Chen, Han-Ping Pu, Chun-Hung Lin, Ming-Da Cheng, Kai-Chiang Wu | 2016-05-31 |
| 9312214 | Semiconductor packages having polymer-containing substrates and methods of forming same | Meng-Tse Chen, Chih-Wei Lin, Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu | 2016-04-12 |
| 9287233 | Adhesive pattern for advance package reliability improvement | Chin-Liang Chen, Wei-Ting Lin, Kuan-Lin Ho, Yu-Chih Liu, Shih-Yen Lin | 2016-03-15 |
| 9281288 | System and method for fine pitch PoP structure | Cheng-Chung Lin, Hsiu-Jen Lin, Cheng-Ting Chen, Ming-Da Cheng, Chung-Shi Liu | 2016-03-08 |
| 9269687 | Packaging methods and packaged semiconductor devices | Meng-Tse Chen, Wei-Hung Lin, Yu-Peng Tsai, Chih-Wei Lin, Ming-Da Cheng +1 more | 2016-02-23 |
| 9257321 | Singulation apparatus and method | Yu-Peng Tsai, Meng-Tse Chen, Ming-Da Cheng, Chung-Shi Liu | 2016-02-09 |
| 9233307 | Fully automatic simulation system of an input device | Hsing-Yuan Shen | 2016-01-12 |
| 9230935 | Package on package structure and method of manufacturing the same | Hsiu-Jen Lin, Cheng-Ting Chen, Wei-Yu Chen, Ming-Da Cheng, Chung-Shi Liu | 2016-01-05 |