Issued Patents 2016
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9437564 | Interconnect structure and method of fabricating same | Wen-Hsiung Lu, Hsuan-Ting Kuo, Ai-Tee Ang, Ming-Da Cheng, Chung-Shi Liu | 2016-09-06 |
| 9418955 | Plasma treatment for semiconductor devices | Chen-Fa Lu, Chung-Shi Liu, Chen-Hua Yu, Wei-Yu Chen | 2016-08-16 |
| 9412689 | Semiconductor packaging structure and method | Chun-Cheng Lin, Chung-Shi Liu, Kuei-Wei Huang, Wei-Hung Lin, Ming-Da Cheng | 2016-08-09 |
| 9373603 | Reflow process and tool | Ai-Tee Ang, Hsiu-Jen Lin, Ming-Da Cheng, Chung-Shi Liu | 2016-06-21 |
| 9355927 | Semiconductor packaging and manufacturing method thereof | Hsiu-Jen Lin, Wen-Hsiung Lu, Hsuan-Ting Kuo, Wei-Yu Chen, Ming-Da Cheng +1 more | 2016-05-31 |
| 9281288 | System and method for fine pitch PoP structure | Cheng-Chung Lin, Hsiu-Jen Lin, Chun-Cheng Lin, Ming-Da Cheng, Chung-Shi Liu | 2016-03-08 |
| 9263839 | System and method for an improved fine pitch joint | Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu, Mirng-Ji Lii | 2016-02-16 |
| 9230935 | Package on package structure and method of manufacturing the same | Chun-Cheng Lin, Hsiu-Jen Lin, Wei-Yu Chen, Ming-Da Cheng, Chung-Shi Liu | 2016-01-05 |