Issued Patents 2016
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9515158 | Semiconductor structure with insertion layer and method for manufacturing the same | Cheng-Wei Lian, Chih-Lin Wang, Kang-Min Kuo | 2016-12-06 |
| 9484285 | Interconnect structures for wafer level package and methods of forming same | Meng-Tse Chen, Hui-Min Huang, Ming-Da Cheng, Chung-Shi Liu, Chen-Hua Yu | 2016-11-01 |
| 9462725 | Server rack and its server device | Maw-Zan Jau, Chao-Jung Chen, Yaw-Tzorng Tsorng | 2016-10-04 |
| 9449908 | Semiconductor package system and method | Hui-Min Huang, Tsai-Tsung Tsai, Ming-Da Cheng, Chung-Shi Liu, Chen-Hua Yu | 2016-09-20 |
| 9425178 | RDL-first packaging process | Shing-Chao Chen, Meng-Tse Chen, Ming-Da Cheng, Chung-Shi Liu | 2016-08-23 |
| 9418978 | Method of forming package-on-package (PoP) structure having a chip package with a plurality of dies attaching to first side of an interposer with a die formed thereon | Chen-Hua Yu, Chung-Shi Liu, Mirng-Ji Lii, Ming-Da Cheng | 2016-08-16 |
| 9412723 | Package on-package structures and methods for forming the same | Kuei-Wei Huang, Hsiu-Jen Lin, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2016-08-09 |
| 9406345 | Horizontal coupling of vertically-oriented hard drive | Wei Yang, Chao-Jung Chen | 2016-08-02 |
| 9401337 | Molding structure for wafer level package | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Wei-Hung Lin, Ming-Da Cheng | 2016-07-26 |
| 9373610 | Process for forming package-on-package structures | Ming-Da Cheng, Meng-Tse Chen, Wen-Hsiung Lu, Kuei-Wei Huang, Chung-Shi Liu | 2016-06-21 |
| 9368460 | Fan-out interconnect structure and method for forming same | Chen-Hua Yu, Yen-Chang Hu, Ching-Wen Hsiao, Mirng-Ji Lii, Chung-Shi Liu +2 more | 2016-06-14 |
| 9343386 | Alignment in the packaging of integrated circuits | Kuei-Wei Huang, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2016-05-17 |
| 9331038 | Semiconductor interconnect structure | Meng-Tse Chen, Hsiu-Jen Lin, Ming-Da Cheng, Chih-Hang Tung, Chung-Shi Liu | 2016-05-03 |
| 9312214 | Semiconductor packages having polymer-containing substrates and methods of forming same | Meng-Tse Chen, Chun-Cheng Lin, Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu | 2016-04-12 |
| 9284424 | Polyimide film and fabrication method thereof | Meng-Ying Tsai | 2016-03-15 |
| 9287203 | Package-on-package structure and method of forming same | Wen-Hsiung Lu, Hsuan-Ting Kuo, Wei-Yu Chen, Ming-Da Cheng, Chung-Shi Liu | 2016-03-15 |
| 9269687 | Packaging methods and packaged semiconductor devices | Meng-Tse Chen, Wei-Hung Lin, Yu-Peng Tsai, Chun-Cheng Lin, Ming-Da Cheng +1 more | 2016-02-23 |
| 9267057 | Polyimide film incorporating polyimide powder delustrant, and manufacture thereof | Chung-Yi Chen, Chi-Huan LO, Shihan Tai | 2016-02-23 |
| 9263595 | Non-volatile memories and methods of fabrication thereof | Yi Fang Lee, Cheng-Ta Wu, Cheng-Yuan Tsai | 2016-02-16 |
| 9252135 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Wei-Hung Lin, Ming-Da Cheng | 2016-02-02 |