Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9418969 | Packaged semiconductor devices and packaging methods | Ching-Wen Hsiao, Chen-Shien Chen | 2016-08-16 |
| 9379078 | 3D die stacking structure with fine pitches | Chen-Hua Yu, Chen-Shien Chen | 2016-06-28 |
| 9368460 | Fan-out interconnect structure and method for forming same | Chen-Hua Yu, Ching-Wen Hsiao, Mirng-Ji Lii, Chung-Shi Liu, Chien Ling Hwang +2 more | 2016-06-14 |