Issued Patents 2016
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9530762 | Semiconductor package, semiconductor device and method of forming the same | Chen-Hua Yu, Chung-Shi Liu, Tsai-Tsung Tsai, Wei-Hung Lin, Ming-Da Cheng | 2016-12-27 |
| 9472525 | Bump-on-trace structures with high assembly yield | Chen-Shien Chen, Chung-Shi Liu, Ming-Da Cheng, Tin-Hao Kuo, Yi-Teh Chou | 2016-10-18 |
| 9401337 | Molding structure for wafer level package | Chen-Hua Yu, Chung-Shi Liu, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng | 2016-07-26 |
| 9324587 | Method for manufacturing semiconductor structure | Chen-Hua Yu, Chun-Hung Lin, Ming-Da Cheng, Chung-Shi Liu, Mirng-Ji Lii | 2016-04-26 |
| 9299688 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng | 2016-03-29 |
| 9252135 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng | 2016-02-02 |