Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9530762 | Semiconductor package, semiconductor device and method of forming the same | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Wei-Hung Lin, Ming-Da Cheng | 2016-12-27 |
| 9449908 | Semiconductor package system and method | Hui-Min Huang, Chih-Wei Lin, Ming-Da Cheng, Chung-Shi Liu, Chen-Hua Yu | 2016-09-20 |
| 9418971 | Package-on-package structure including a thermal isolation material and method of forming the same | Meng-Tse Chen, Kuei-Wei Huang, Ai-Tee Ang, Ming-Da Cheng, Chung-Shi Liu | 2016-08-16 |
| 9385040 | Method of manufacturing a semiconductor device | Wen-Hsiung Lu, Yu-Peng Tsai, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2016-07-05 |