Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502373 | Lid attach process and apparatus for fabrication of semiconductor packages | Chin-Liang Chen, Wei-Ting Lin, Yu-Chih Liu, Jason Shen | 2016-11-22 |
| 9415501 | Apparatus for manufacturing a semiconductor device and method of manufacturing a semiconductor device | Chin-Liang Chen, Wei-Ting Lin, Yu-Chih Liu, Shih-Yen Lin | 2016-08-16 |
| 9287233 | Adhesive pattern for advance package reliability improvement | Chin-Liang Chen, Wei-Ting Lin, Yu-Chih Liu, Chun-Cheng Lin, Shih-Yen Lin | 2016-03-15 |