Issued Patents 2016
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9497861 | Methods and apparatus for package with interposers | Chun-Lin Lu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang | 2016-11-15 |
| 9478511 | Methods and apparatus of packaging semiconductor devices | Chun-Lin Lu, Hsien-Wei Chen, Hung-Jui Kuo | 2016-10-25 |
| 9472524 | Copper-containing layer on under-bump metallization layer | Yu-Feng Chen, Chun-Hung Lin, Han-Ping Pu, Chih-Hang Tung, Ming-Che Ho | 2016-10-18 |
| 9472523 | Semiconductor structure and manufacturing method thereof | Chia-Chun Miao, Shih-Wei Liang, Yen-Ping Wang, Ming-Kai Liu | 2016-10-18 |
| 9460989 | Interposer having a defined through via pattern | Shih-Wei Liang, Ming-Kai Liu, Chia-Chun Miao, Chun-Lin Lu | 2016-10-04 |
| 9418947 | Mechanisms for forming connectors with a molding compound for package on package | Yu-Feng Chen, Chun-Hung Lin, Han-Ping Pu, Ming-Da Cheng | 2016-08-16 |
| 9412661 | Method for forming package-on-package structure | Chun-Lin Lu, Ming-Kai Liu, Ching-Feng Yang | 2016-08-09 |
| 9397060 | Package on package structure | Chen-Hua Yu, Mirng-Ji Lii, Hao-Yi Tsai, Hsien-Wei Chen | 2016-07-19 |
| 9391012 | Methods and apparatus for package with interposers | Hsien-Wei Chen, Yu-Feng Chen, Chun-Hung Lin, Ming-Kai Liu, Chun-Lin Lu | 2016-07-12 |
| 9373599 | Methods and apparatus for package on package devices | Ming-Kai Liu, Hsien-Wei Chen, Shih-Wei Liang | 2016-06-21 |
| 9355982 | Semiconductor structure and manufacturing method thereof | Chun-Lin Lu | 2016-05-31 |
| 9355928 | Package-on-package structure | Yu-Feng Chen, Han-Ping Pu, Chun-Hung Lin, Chun-Cheng Lin, Ming-Da Cheng | 2016-05-31 |
| 9355924 | Integrated circuit underfill scheme | Shih-Wei Liang, Chun-Lin Lu, Ching-Feng Yang, Ming-Kai Liu, Chia-Chun Miao +1 more | 2016-05-31 |
| 9331023 | Device packaging | Ming-Kai Liu, Yu-Peng Tsai, Wei-Hung Lin, Hao-Yi Tsai, Mirng-Ji Lii | 2016-05-03 |
| 9263405 | Semiconductor device | Chia-Chun Miao, Shih-Wei Liang, Yen-Ping Wang | 2016-02-16 |
| 9236322 | Methods and apparatus for heat spreader on silicon | Hsien-Wei Chen, Chung-Ying Yang, Chao-Wen Shih | 2016-01-12 |