Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9349663 | Package-on-package structure having polymer-based material for warpage control | Meng-Tse Chen, Yu-Chih Liu, Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng +1 more | 2016-05-24 |