Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9524959 | System on integrated chips and methods of forming same | Chen-Hua Yu, Ming-Fa Chen | 2016-12-20 |
| 9508703 | Stacked dies with wire bonds and method | Chen-Hua Yu, Ming-Fa Chen, Meng-Tse Chen, Hui-Min Huang, Hsiu-Jen Lin +2 more | 2016-11-29 |
| 9331021 | Chip-on-wafer package and method of forming same | Chen-Hua Yu, Ming-Fa Chen | 2016-05-03 |