Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9449934 | Solder joint structure for ball grid array in wafer level package | Wei-Yu Chen, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2016-09-20 |
| 9318386 | Wafer alignment methods in die sawing process | Ming-Da Cheng, Chung-Shi Liu | 2016-04-19 |
| 9318429 | Integrated structure in wafer level package | Hung-Jui Kuo, Chung-Shi Liu | 2016-04-19 |