Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9449931 | Pillar bumps and process for making same | Cheng-Chung Lin, Chung-Shi Liu, Meng-Wei Chou, Kuo-Cheng Lin, Wen-Hsiung Lu +2 more | 2016-09-20 |
| 9397080 | Package on package devices and methods of packaging semiconductor dies | Chun-Lei Hsu, Yu-Feng Chen, Ming-Che Ho, Chung-Shi Liu | 2016-07-19 |