Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9397080 | Package on package devices and methods of packaging semiconductor dies | Yu-Feng Chen, Ming-Che Ho, De-Yuan Lu, Chung-Shi Liu | 2016-07-19 |
| 9257401 | Method of fabricating bump structure and bump structure | Ming-Che Ho, Ming-Da Cheng, Chung-Shi Liu | 2016-02-09 |