Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9514978 | Method of forming semiconductor device having a conductive via structure | Kuo-Chin Chang | 2016-12-06 |
| 9406634 | Package structure and method of forming the same | Han-Ping Pu, Yu-Feng Chen, Tin-Hao Kuo | 2016-08-02 |