Issued Patents 2016
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502383 | 3D integrated circuit package processing with panel type lid | Tsung-Ding Wang, Han-Ping Pu, Jung Wei Cheng, Chien Ling Hwang, Hsin-Yu Pan | 2016-11-22 |
| 9496249 | 3DIC package and methods of forming the same | Szu-Po Huang, Shin-Puu Jeng, Wensen Hung | 2016-11-15 |
| 9462692 | Test structure and method of testing electrical characteristics of through vias | Shang-Yun Hou, Wei-Cheng Wu, Hsien-Pin Hu, Jung Cheng Ko, Shin-Puu Jeng +1 more | 2016-10-04 |
| 9385095 | 3D semiconductor package interposer with die cavity | Shin-Puu Jeng, Shang-Yun Hou, Wensen Hung, Szu-Po Huang | 2016-07-05 |
| 9379036 | 3DIC packages with heat dissipation structures | Wensen Hung, Szu-Po Huang, Shin-Puu Jeng | 2016-06-28 |
| 9269694 | Packages with thermal management features for reduced thermal crosstalk and methods of forming same | Wensen Hung, Szu-Po Huang, Shin-Puu Jeng | 2016-02-23 |