Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9462692 | Test structure and method of testing electrical characteristics of through vias | Shang-Yun Hou, Wei-Cheng Wu, Hsien-Pin Hu, Shin-Puu Jeng, Chen-Hua Yu +1 more | 2016-10-04 |