Issued Patents 2016
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9530730 | Configurable routing for packaging applications | Chung-Yu Lu, Shin-Puu Jeng, Shang-Yun Hou, Tzuan-Horng Liu, Shih-Wen Huang +1 more | 2016-12-27 |
| 9462692 | Test structure and method of testing electrical characteristics of through vias | Shang-Yun Hou, Wei-Cheng Wu, Jung Cheng Ko, Shin-Puu Jeng, Chen-Hua Yu +1 more | 2016-10-04 |
| 9385079 | Methods for forming stacked capacitors with fuse protection | Shih-Cheng Chang, Liang-Chen Lin, Fu-Tsai Hou, Tung-Chin Yeh, Shih-Kai Lin +2 more | 2016-07-05 |
| 9373673 | 3-D inductor and transformer | Hsiao-Tsung Yen, Chin-Wei Kuo, Sally Liu, Ming-Fa Chen, Jhe-Ching Lu | 2016-06-21 |
| 9372206 | Testing of semiconductor chips with microbumps | Wei-Cheng Wu, Shang-Yun Hou, Shin-Puu Jeng, Chen-Hua Yu, Chao-Hsiang Yang | 2016-06-21 |
| 9305808 | Methods and apparatus of packaging with interposers | Chung-Yu Lu, Hsiao-Tsung Yen, Tzuan-Horng Liu, Shih-Wen Huang, Shang-Yun Hou +1 more | 2016-04-05 |
| 9299649 | 3D packages and methods for forming the same | Tzu-Wei Chiu, Cheng-Hsien Hsieh, Kuo-Ching Hsu, Shang-Yun Hou, Shin-Puu Jeng | 2016-03-29 |