Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9337118 | Stress buffer structures in a mounting structure of a semiconductor device | Tzu-Yu Wang, Shin-Puu Jeng | 2016-05-10 |
| 9299649 | 3D packages and methods for forming the same | Cheng-Hsien Hsieh, Hsien-Pin Hu, Kuo-Ching Hsu, Shang-Yun Hou, Shin-Puu Jeng | 2016-03-29 |