Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9372951 | Semiconductor device design methods and conductive bump pattern enhancement methods | Wei-Cheng Wu, Kuo-Ching Hsu, Shang-Yun Hou, Shin-Puu Jeng | 2016-06-21 |
| 9337118 | Stress buffer structures in a mounting structure of a semiconductor device | Tzu-Wei Chiu, Shin-Puu Jeng | 2016-05-10 |