Issued Patents 2016
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508666 | Packaging structures and methods with a metal pillar | Chen-Hua Yu, Shin-Puu Jeng, Shang-Yun Hou, Cheng-Chieh Hsieh, Ying-Ching Shih +3 more | 2016-11-29 |
| 9372951 | Semiconductor device design methods and conductive bump pattern enhancement methods | Tzu-Yu Wang, Wei-Cheng Wu, Shang-Yun Hou, Shin-Puu Jeng | 2016-06-21 |
| 9355980 | Three-dimensional chip stack and method of forming the same | Wei-Ming Chen, Cheng-Hsien Hsieh, Sung-Hui Huang | 2016-05-31 |
| 9349699 | Front side copper post joint structure for temporary bond in TSV application | Hon-Lin Huang, Ching-Wen Hsiao, Chen-Shien Chen | 2016-05-24 |
| 9343419 | Bump structures for semiconductor package | Chen-Hua Yu, Meng-Liang Lin, Jy-Jie Gau, Cheng-Lin Huang, Jing-Cheng Lin | 2016-05-17 |
| 9312225 | Bump structure for stacked dies | Hung-Pin Chang, Chen-Shien Chen, Wen-Chih Chiou, Chen-Hua Yu | 2016-04-12 |
| 9299649 | 3D packages and methods for forming the same | Tzu-Wei Chiu, Cheng-Hsien Hsieh, Hsien-Pin Hu, Shang-Yun Hou, Shin-Puu Jeng | 2016-03-29 |