Issued Patents 2016
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508666 | Packaging structures and methods with a metal pillar | Chen-Hua Yu, Shin-Puu Jeng, Shang-Yun Hou, Kuo-Ching Hsu, Cheng-Chieh Hsieh +3 more | 2016-11-29 |
| 9475272 | De-bonding and cleaning process and system | Jing-Cheng Lin, Szu-Wei Lu | 2016-10-25 |
| 9472516 | Fan out package structure and methods of forming | Pu Wang, Szu-Wei Lu, Jing-Cheng Lin | 2016-10-18 |
| 9406588 | Semiconductor package and manufacturing method thereof | Jing-Cheng Lin, Po-Hao Tsai, Szu-Wei Lu | 2016-08-02 |
| 9406500 | Flux residue cleaning system and method | I-Ting Chen, Szu-Wei Lu, Jing-Cheng Lin | 2016-08-02 |
| 9349701 | Self-aligning conductive bump structure and method of fabrication | Cheng-Lin Huang, I-Ting Chen, Po-Hao Tsai, Szu-Wei Lu, Jing-Cheng Lin +2 more | 2016-05-24 |
| 9343431 | Dam structure for enhancing joint yield in bonding processes | Szu-Wei Lu, Jing-Cheng Lin | 2016-05-17 |