Issued Patents 2016
Showing 1–25 of 61 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9514988 | Semiconductor devices and packaging methods thereof | Shih-Ting Lin, Szu-Wei Lu | 2016-12-06 |
| 9508664 | Semiconductor device structure comprising a plurality of metal oxide fibers and method for forming the same | Chen-Hua Yu, Szu-Wei Lu, Yen-Yao Chi | 2016-11-29 |
| 9508666 | Packaging structures and methods with a metal pillar | Chen-Hua Yu, Shin-Puu Jeng, Shang-Yun Hou, Kuo-Ching Hsu, Cheng-Chieh Hsieh +3 more | 2016-11-29 |
| 9502380 | Three dimensional integrated circuits stacking approach | Shang-Yun Hou | 2016-11-22 |
| 9502271 | Warpage control for flexible substrates | Chen-Hua Yu, Shih-Ting Lin, Shang-Yun Hou, Szu-Wei Lu | 2016-11-22 |
| 9496235 | Pillar design for conductive bump | Cheng-Chieh Hsieh, Cheng-Lin Huang, Po-Hao Tsai, Shang-Yun Hou, Shin-Puu Jeng | 2016-11-15 |
| 9490190 | Thermal dissipation through seal rings in 3DIC structure | Shih-Yi Syu | 2016-11-08 |
| 9478498 | Through package via (TPV) | Po-Hao Tsai | 2016-10-25 |
| 9475272 | De-bonding and cleaning process and system | Ying-Ching Shih, Szu-Wei Lu | 2016-10-25 |
| 9478480 | Alignment mark and method of formation | Chen-Yu Tsai, Shih-Hui Wang, Chien-Ming Chiu, Chia-Ho Chen, Fang Wen Tsai +4 more | 2016-10-25 |
| 9472516 | Fan out package structure and methods of forming | Pu Wang, Ying-Ching Shih, Szu-Wei Lu | 2016-10-18 |
| 9466581 | Semiconductor package device and manufacturing method thereof | Nai-Wei Liu, Jui-Pin Hung | 2016-10-11 |
| 9461018 | Fan-out PoP structure with inconsecutive polymer layer | Yi-Lin Tsai, Jeffrey Chang, Nai-Wei Liu, Tsei-Chung Fu | 2016-10-04 |
| 9460987 | Interconnect structure for package-on-package devices and a method of fabricating | Jui-Pin Hung, Po-Hao Tsai, Yi-Jou Lin, Shuo-Mao Chen, Chiung-Han Yeh +1 more | 2016-10-04 |
| 9455211 | Integrated fan-out structure with openings in buffer layer | Wu Sen Chiu, Li-Hui Cheng, Po-Hao Tsai | 2016-09-27 |
| 9443814 | Bump structures for multi-chip packaging | Chen-Hua Yu | 2016-09-13 |
| 9443783 | 3DIC stacking device and method of manufacture | Chen-Hua Yu | 2016-09-13 |
| 9431367 | Method of forming a semiconductor package | Chin-Chuan Chang, Jui-Pin Hung | 2016-08-30 |
| 9425128 | 3-D package having plurality of substrates | Chin-Chuan Chang, Chen-Hua Yu | 2016-08-23 |
| 9425067 | Method for forming package systems having interposers | Yung-Chi Lin, Chen-Hua Yu | 2016-08-23 |
| 9425121 | Integrated fan-out structure with guiding trenches in buffer layer | Po-Hao Tsai, Feng-Cheng Hsu, Li-Hui Cheng, Jui-Pin Hung | 2016-08-23 |
| 9418876 | Method of three dimensional integrated circuit assembly | Weng-Jin Wu, Shih-Ting Lin, Cheng-Lin Huang, Szu-Wei Lu, Shin-Puu Jeng +1 more | 2016-08-16 |
| 9412662 | Structure and approach to prevent thin wafer crack | Shih-Ting Lin, Szu-Wei Lu | 2016-08-09 |
| 9406588 | Semiconductor package and manufacturing method thereof | Po-Hao Tsai, Ying-Ching Shih, Szu-Wei Lu | 2016-08-02 |
| 9406598 | Package with a fan-out structure and method of forming the same | Yi-Chao Mao, Chin-Chuan Chang, Jui-Pin Hung | 2016-08-02 |