Issued Patents 2016
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9514986 | Device with capped through-substrate via structure | Yen-Hung Chen, Yin Chen, Ebin Liao, Ku-Feng Yang, Tsang-Jiuh Wu +1 more | 2016-12-06 |
| 9449898 | Semiconductor device having backside interconnect structure through substrate via and method of forming the same | Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Hong-Ye Shih, Chia-Yin Chen +3 more | 2016-09-20 |
| 9425067 | Method for forming package systems having interposers | Jing-Cheng Lin, Chen-Hua Yu | 2016-08-23 |
| 9425126 | Dummy structure for chip-on-wafer-on-substrate | Pei-Ching Kuo, Yi-Hsiu Chen, Jun-Lin Yeh, Li-Han Hsu, Wei-Cheng Wu +2 more | 2016-08-23 |
| 9418933 | Through-substrate via formation with improved topography control | Yi-Hsiu Chen, Ku-Feng Yang, Wen-Chih Chiou | 2016-08-16 |
| 9373575 | TSV structures and methods for forming the same | Hsin-Yu Chen, Wen-Chih Chiou, Ku-Feng Yang, Tsang-Jiuh Wu, Jing-Cheng Lin | 2016-06-21 |
| 9343390 | TSV formation processes using TSV-last approach | Jing C. Lin, Ku-Feng Yang | 2016-05-17 |
| 9287440 | Method of manufacturing a semiconductor device including through silicon plugs | Chen-Hua Yu, Hung-Pin Chang, Chia-Lin Yu, Jui-Pin Hung, Chien Ling Hwang | 2016-03-15 |
| 9252110 | Interconnect structure and method of forming same | Hsiao Yun Lo, Lin-Chih Huang, Tasi-Jung Wu, Hsin-Yu Chen, Ku-Feng Yang +2 more | 2016-02-02 |