Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9312225 | Bump structure for stacked dies | Kuo-Ching Hsu, Chen-Shien Chen, Wen-Chih Chiou, Chen-Hua Yu | 2016-04-12 |
| 9293418 | Backside through vias in a bonded structure | Weng-Jin Wu, Ku-Feng Yang, Wen-Chih Chiou, Chen-Hua Yu | 2016-03-22 |
| 9287440 | Method of manufacturing a semiconductor device including through silicon plugs | Chen-Hua Yu, Yung-Chi Lin, Chia-Lin Yu, Jui-Pin Hung, Chien Ling Hwang | 2016-03-15 |