Issued Patents 2016
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9515108 | Image sensors with contamination barrier structures | Yu-Te HSIEH | 2016-12-06 |
| 9478480 | Alignment mark and method of formation | Chen-Yu Tsai, Shih-Hui Wang, Chien-Ming Chiu, Chia-Ho Chen, Fang Wen Tsai +4 more | 2016-10-25 |
| 9418876 | Method of three dimensional integrated circuit assembly | Jing-Cheng Lin, Shih-Ting Lin, Cheng-Lin Huang, Szu-Wei Lu, Shin-Puu Jeng +1 more | 2016-08-16 |
| 9418961 | Apparatus and method of substrate to substrate bonding for three dimensional (3D) IC interconnects | Chen-Hua Yu, Wen-Chih Chiou | 2016-08-16 |
| 9299594 | Substrate bonding system and method of modifying the same | Yu-Liang Lin, Jing-Cheng Lin | 2016-03-29 |
| 9299612 | Stacked structures and methods of forming stacked structures | Wen-Chih Chiou, Chen-Hua Yu | 2016-03-29 |
| 9293418 | Backside through vias in a bonded structure | Ku-Feng Yang, Hung-Pin Chang, Wen-Chih Chiou, Chen-Hua Yu | 2016-03-22 |
| 9287166 | Barrier for through-silicon via | Chen-Hua Yu, Wen-Chih Chiou | 2016-03-15 |