Issued Patents 2016
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9514988 | Semiconductor devices and packaging methods thereof | Shih-Ting Lin, Jing-Cheng Lin | 2016-12-06 |
| 9508664 | Semiconductor device structure comprising a plurality of metal oxide fibers and method for forming the same | Jing-Cheng Lin, Chen-Hua Yu, Yen-Yao Chi | 2016-11-29 |
| 9502271 | Warpage control for flexible substrates | Chen-Hua Yu, Shih-Ting Lin, Jing-Cheng Lin, Shang-Yun Hou | 2016-11-22 |
| 9475272 | De-bonding and cleaning process and system | Ying-Ching Shih, Jing-Cheng Lin | 2016-10-25 |
| 9472516 | Fan out package structure and methods of forming | Pu Wang, Ying-Ching Shih, Jing-Cheng Lin | 2016-10-18 |
| 9418876 | Method of three dimensional integrated circuit assembly | Jing-Cheng Lin, Weng-Jin Wu, Shih-Ting Lin, Cheng-Lin Huang, Shin-Puu Jeng +1 more | 2016-08-16 |
| 9412662 | Structure and approach to prevent thin wafer crack | Shih-Ting Lin, Jing-Cheng Lin | 2016-08-09 |
| 9406588 | Semiconductor package and manufacturing method thereof | Jing-Cheng Lin, Po-Hao Tsai, Ying-Ching Shih | 2016-08-02 |
| 9406500 | Flux residue cleaning system and method | I-Ting Chen, Ying-Ching Shih, Jing-Cheng Lin | 2016-08-02 |
| 9379041 | Fan out package structure | Feng-Cheng Hsu, Jing-Cheng Lin | 2016-06-28 |
| 9368458 | Die-on-interposer assembly with dam structure and method of manufacturing the same | Chih-Wei Wu, Jing-Cheng Lin | 2016-06-14 |
| 9349701 | Self-aligning conductive bump structure and method of fabrication | Cheng-Lin Huang, I-Ting Chen, Ying-Ching Shih, Po-Hao Tsai, Jing-Cheng Lin +2 more | 2016-05-24 |
| 9343431 | Dam structure for enhancing joint yield in bonding processes | Ying-Ching Shih, Jing-Cheng Lin | 2016-05-17 |
| 9337096 | Apparatus and methods for molding die on wafer interposers | Chung Yu Wang, Chih-Wei Wu, Jing-Cheng Lin | 2016-05-10 |
| 9312149 | Method for forming chip-on-wafer assembly | Jing-Cheng Lin, Cheng-Lin Huang, Jui-Pin Hung, Shin-Puu Jeng, Chen-Hua Yu | 2016-04-12 |
| 9293369 | Three-dimensional integrated circuit (3DIC) | Chih-Wei Wu, Jing-Cheng Lin, Shin-Puu Jeng, Chen-Hua Yu | 2016-03-22 |
| 9281297 | Solution for reducing poor contact in info packages | Jing-Cheng Lin, Chen-Hua Yu, Shih-Ting Lin, Shin-Puu Jeng | 2016-03-08 |
| 9275948 | Integrated circuit having stress tuning layer | Shin-Puu Jeng, Clinton Chao | 2016-03-01 |
| 9245773 | Semiconductor device packaging methods and structures thereof | Jing-Cheng Lin, I-Hsuan Peng | 2016-01-26 |