Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9362474 | Vertical LED chip package on TSV carrier | — | 2016-06-07 |
| 9343505 | Wafer level reflector for LED packaging | Hao-Wei Ku, Yu-Sheng Tang, Hsin-Hung Chen, Hao-Yu Yang, Ching-Yi Chen +5 more | 2016-05-17 |
| 9337063 | Package for three dimensional integrated circuit | Chih-Hao Chen, Long Hua Lee, Chun-Hsing Su, Yi-Lin Tsai, Kung-Chen Yeh +2 more | 2016-05-10 |
| 9337096 | Apparatus and methods for molding die on wafer interposers | Chih-Wei Wu, Szu-Wei Lu, Jing-Cheng Lin | 2016-05-10 |