Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9530646 | Method of forming a semiconductor structure | Li-Wei Feng, Shih-Hung Tsai, Chao-Hung Lin, Hon-Huei Liu, An-Chi Liu +8 more | 2016-12-27 |
| 9449567 | Common voltage compensation in display apparatus | Ying-Ji Chen, Kun-Lang Wu, Teng-Liang Yu, Wen-Chieh Huang | 2016-09-20 |
| 9368458 | Die-on-interposer assembly with dam structure and method of manufacturing the same | Szu-Wei Lu, Jing-Cheng Lin | 2016-06-14 |
| 9337096 | Apparatus and methods for molding die on wafer interposers | Chung Yu Wang, Szu-Wei Lu, Jing-Cheng Lin | 2016-05-10 |
| 9293369 | Three-dimensional integrated circuit (3DIC) | Szu-Wei Lu, Jing-Cheng Lin, Shin-Puu Jeng, Chen-Hua Yu | 2016-03-22 |