Issued Patents 2016
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9514988 | Semiconductor devices and packaging methods thereof | Szu-Wei Lu, Jing-Cheng Lin | 2016-12-06 |
| 9502271 | Warpage control for flexible substrates | Chen-Hua Yu, Jing-Cheng Lin, Shang-Yun Hou, Szu-Wei Lu | 2016-11-22 |
| 9418876 | Method of three dimensional integrated circuit assembly | Jing-Cheng Lin, Weng-Jin Wu, Cheng-Lin Huang, Szu-Wei Lu, Shin-Puu Jeng +1 more | 2016-08-16 |
| 9412662 | Structure and approach to prevent thin wafer crack | Jing-Cheng Lin, Szu-Wei Lu | 2016-08-09 |
| 9382112 | Manufacturing methods for micro-electromechanical system device having electrical insulating structure | Yu-Wen Hsu, Jen-Yi Chen, Chao-Ta Huang | 2016-07-05 |
| 9281297 | Solution for reducing poor contact in info packages | Jing-Cheng Lin, Chen-Hua Yu, Szu-Wei Lu, Shin-Puu Jeng | 2016-03-08 |
| 9227841 | Apparatus integrating microelectromechanical system device with circuit chip and methods for fabricating the same | Chao-Ta Huang, Yu-Wen Hsu | 2016-01-05 |