Issued Patents 2016
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9511299 | Rotary dynamic simulation device and audiovisual apparatus using the same | Deng-Horng Lai, Ke-Cheng Chien | 2016-12-06 |
| 9508666 | Packaging structures and methods with a metal pillar | Chen-Hua Yu, Shin-Puu Jeng, Shang-Yun Hou, Kuo-Ching Hsu, Cheng-Chieh Hsieh +3 more | 2016-11-29 |
| 9496235 | Pillar design for conductive bump | Cheng-Chieh Hsieh, Po-Hao Tsai, Shang-Yun Hou, Jing-Cheng Lin, Shin-Puu Jeng | 2016-11-15 |
| 9418876 | Method of three dimensional integrated circuit assembly | Jing-Cheng Lin, Weng-Jin Wu, Shih-Ting Lin, Szu-Wei Lu, Shin-Puu Jeng +1 more | 2016-08-16 |
| 9379080 | Method and apparatus for a conductive pillar structure | Jung-Hua Chang, Nai-Wei Liu, Jui-Pin Hung, Jing-Cheng Lin | 2016-06-28 |
| 9349701 | Self-aligning conductive bump structure and method of fabrication | I-Ting Chen, Ying-Ching Shih, Po-Hao Tsai, Szu-Wei Lu, Jing-Cheng Lin +2 more | 2016-05-24 |
| 9343419 | Bump structures for semiconductor package | Chen-Hua Yu, Meng-Liang Lin, Jy-Jie Gau, Jing-Cheng Lin, Kuo-Ching Hsu | 2016-05-17 |
| 9312149 | Method for forming chip-on-wafer assembly | Jing-Cheng Lin, Szu-Wei Lu, Jui-Pin Hung, Shin-Puu Jeng, Chen-Hua Yu | 2016-04-12 |
| 9299680 | Integrated circuit structure having dies with connectors | Jing-Cheng Lin | 2016-03-29 |
| 9230934 | Surface treatment in electroless process for adhesion enhancement | Jing-Cheng Lin, Wei-An Tsao | 2016-01-05 |