JG

Jy-Jie Gau

TSMC: 1 patents #1,374 of 2,623Top 55%
📍 Baoshan, TW: #165 of 483 inventorsTop 35%
Overall (2016): #337,913 of 481,213Top 75%
1
Patents 2016

Issued Patents 2016

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9343419 Bump structures for semiconductor package Chen-Hua Yu, Meng-Liang Lin, Cheng-Lin Huang, Jing-Cheng Lin, Kuo-Ching Hsu 2016-05-17