Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9343419 | Bump structures for semiconductor package | Chen-Hua Yu, Jy-Jie Gau, Cheng-Lin Huang, Jing-Cheng Lin, Kuo-Ching Hsu | 2016-05-17 |
ML
Meng-Liang Lin
Overall (2016): #295,128 of 481,213Top 65%
1
Patents 2016