Issued Patents 2016
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508666 | Packaging structures and methods with a metal pillar | Chen-Hua Yu, Shin-Puu Jeng, Shang-Yun Hou, Kuo-Ching Hsu, Ying-Ching Shih +3 more | 2016-11-29 |
| 9496235 | Pillar design for conductive bump | Cheng-Lin Huang, Po-Hao Tsai, Shang-Yun Hou, Jing-Cheng Lin, Shin-Puu Jeng | 2016-11-15 |
| 9449947 | Semiconductor package for thermal dissipation | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen, Ming-Yen Chiu | 2016-09-20 |
| 9443806 | Chip packages and methods of manufacturing the same | Shin-Puu Jeng, Tsung-Shu Lin, Chen-Hua Yu | 2016-09-13 |
| 9391000 | Methods for forming silicon-based hermetic thermal solutions | Jing-Cheng Lin | 2016-07-12 |
| 9385091 | Reinforcement structure and method for controlling warpage of chip mounted on substrate | Chen-Hua Yu, Shang-Yun Hou, Tsung-Shu Lin | 2016-07-05 |
| 9337123 | Thermal structure for integrated circuit package | Way Lee Cheng, Shang-Yun Hou, Shin-Puu Jeng | 2016-05-10 |
| 9318528 | Image sensor device and method | Kuo-Chin Huang, Tzu-Jui Wang, Szu-Ying Chen, Dun-Nian Yaung, Jen-Cheng Liu +2 more | 2016-04-19 |