Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9337123 | Thermal structure for integrated circuit package | Cheng-Chieh Hsieh, Shang-Yun Hou, Shin-Puu Jeng | 2016-05-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9337123 | Thermal structure for integrated circuit package | Cheng-Chieh Hsieh, Shang-Yun Hou, Shin-Puu Jeng | 2016-05-10 |