Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9449933 | Packaging device and method of making the same | Chang-Chia Huang, Ming-Da Cheng, Wen-Hsiung Lu, Bor-Rung Su | 2016-09-20 |
| 9443806 | Chip packages and methods of manufacturing the same | Shin-Puu Jeng, Cheng-Chieh Hsieh, Chen-Hua Yu | 2016-09-13 |
| 9385091 | Reinforcement structure and method for controlling warpage of chip mounted on substrate | Chen-Hua Yu, Shang-Yun Hou, Cheng-Chieh Hsieh | 2016-07-05 |