Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9461020 | Semiconductor package including an embedded surface mount device and method of forming the same | Der-Chyang Yeh, Hsien-Wei Chen, Ying-Ju Chen | 2016-10-04 |
| 9449947 | Semiconductor package for thermal dissipation | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen, Cheng-Chieh Hsieh | 2016-09-20 |