Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9466581 | Semiconductor package device and manufacturing method thereof | Jui-Pin Hung, Jing-Cheng Lin | 2016-10-11 |
| 9461018 | Fan-out PoP structure with inconsecutive polymer layer | Yi-Lin Tsai, Jeffrey Chang, Jing-Cheng Lin, Tsei-Chung Fu | 2016-10-04 |
| 9379080 | Method and apparatus for a conductive pillar structure | Jung-Hua Chang, Cheng-Lin Huang, Jui-Pin Hung, Jing-Cheng Lin | 2016-06-28 |
| 9312148 | Method of packaging a semiconductor device | Jing-Cheng Lin, Jui-Pin Hung, Yi-Chao Mao, Wan-Ting Shih, Tsan-Hua Tung | 2016-04-12 |
| 9230902 | Interconnect structure for wafer level package | Chen-Hua Yu, Jing-Cheng Lin, Jui-Pin Hung, Shin-Puu Jeng | 2016-01-05 |