WS

Wan-Ting Shih

TSMC: 1 patents #1,374 of 2,623Top 55%
📍 Touwu, TW: #1 of 1 inventorsTop 100%
Overall (2016): #188,988 of 481,213Top 40%
1
Patents 2016

Issued Patents 2016

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9312148 Method of packaging a semiconductor device Jing-Cheng Lin, Jui-Pin Hung, Nai-Wei Liu, Yi-Chao Mao, Tsan-Hua Tung 2016-04-12