YM

Yi-Chao Mao

TSMC: 3 patents #677 of 2,623Top 30%
📍 Houliao, TW: #5 of 6 inventorsTop 85%
Overall (2016): #49,651 of 481,213Top 15%
3
Patents 2016

Issued Patents 2016

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
9406598 Package with a fan-out structure and method of forming the same Chin-Chuan Chang, Jui-Pin Hung, Jing-Cheng Lin 2016-08-02
9358660 Grinding wheel design with elongated teeth arrangement Chun-Hsing Su, Jing-Cheng Lin, Tsei-Chung Fu, Wen-Hua Chang 2016-06-07
9312148 Method of packaging a semiconductor device Jing-Cheng Lin, Jui-Pin Hung, Nai-Wei Liu, Wan-Ting Shih, Tsan-Hua Tung 2016-04-12