Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9431367 | Method of forming a semiconductor package | Jing-Cheng Lin, Jui-Pin Hung | 2016-08-30 |
| 9425128 | 3-D package having plurality of substrates | Jing-Cheng Lin, Chen-Hua Yu | 2016-08-23 |
| 9406598 | Package with a fan-out structure and method of forming the same | Yi-Chao Mao, Jui-Pin Hung, Jing-Cheng Lin | 2016-08-02 |