Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9425121 | Integrated fan-out structure with guiding trenches in buffer layer | Po-Hao Tsai, Li-Hui Cheng, Jui-Pin Hung, Jing-Cheng Lin | 2016-08-23 |
| 9379041 | Fan out package structure | Szu-Wei Lu, Jing-Cheng Lin | 2016-06-28 |
| 9323155 | Double patterning strategy for contact hole and trench in photolithography | Chun-Kuang Chen, Hsiao-Wei Yeh, Chih-An Lin, Chien-Wei Wang | 2016-04-26 |